Study at a partner university in Taiwan and gain practical experience at the semiconductor manufacturer TSMC: the Semiconductor Talent Incubation Programme Taiwan (STIPT) offers HTWD students the opportunity to combine an international study experience with insights into the semiconductor industry. The next application period for the 2027/28 winter semester runs from 15 November to 15 December 2026.

The STIPT scholarship programme combines a four-month study placement at a partner university in Taiwan with a subsequent practical training placement lasting several weeks at Taiwan Semiconductor Manufacturing Company (TSMC), a world-leading semiconductor company.

The funding covers tuition and programme fees, a monthly allowance of 700 euros towards living costs, and 1,500 euros for travel expenses.

The programme is aimed at students of Electrical Engineering, micro- and nanoelectronics, Mechanical Engineering, mechatronics, robotics, physics and chemistry. Master’s students from the first semester onwards, as well as Bachelor’s and Diplom students from the second semester onwards, are eligible to apply.

Applications and further information

The next call for applications for the 2027/28 winter semester runs from 15 November to 15 December 2026. Information on the eligibility criteria and the application procedure is available on the Leonardo-Sachsen website.

HTW Dresden promotes studying in Dresden at an education fair in Taiwan

HTWD is also expanding its contacts with Taiwan in the field of international student recruitment. Together with the Saxony Liaison Office in Taiwan (SSLO), West Saxon University of Applied Sciences Zwickau, TU Dresden and the University of Leipzig, the Head of the International Office attended the EEFT education fair in Taipei and Kaohsiung. There, she provided information about the range of degree programmes offered by HTWD and promoted studying in Dresden to prospective Taiwanese students.