Printed Circuit Board Laboratory

Faculty of Electrical Engineering

Printed circuit board (PCB) laboratory

Room: S 406

Phone: +49 351 462-2934

PCB laboratory
HTW Dresden/Bauer

The PCB laboratory is used for teaching and research at the Faculty of Electrical Engineering. The design and use of the laboratory enables practical training and the development of engineering and practical skills among the students. The focus is on the constructive-technological development of electronic assemblies as an essential element of the engineering development goals in electrical engineering.

Through close cooperation with the faculty's CAD laboratory, the entire chain of computer-aided design, mechanical production and the special technologies of electronics, including selected methods for characterizing the assemblies, is to be made accessible to students in practical training. The focus of the laboratory is therefore on the manufacture and characterization of electronic assemblies.

The development and evaluation of electronic assemblies and devices are also focal points of research, whereby in addition to the observation of known technologies and the analysis of occurring effects, the development of new constructive-technological solutions for a wide variety of applications is of interest.

 

[Translate to English:] SMD-Handbestückung
HTW Dresden/Bauer
SMD manual assembly in the PCB laboratory

Due to the different requirements of the technologies and equipment, it is necessary to divide the facilities into several areas:

  • PCB manufacturing
  • Thick film technology
  • Module assembly (THT, SMT) / Electronics assembly

Possibilities in the laboratory

Hand soldering workstations with exhaust air SMD soldering workstation with exhaust air
Reflow soldering Annealing in the heating cabinet & sintering furnace
Pneumatic hand dispensing Screen & stencil/paste printing
Manual SMD placement Partially automatic SMD placement machine
Manual drilling work Automated drilling/milling work on PCB
Production of board layout films (injection >150µ) Production of printed circuit boards (1 & 2 layers)
Manual through-hole plating (rivets) Galvanic through-hole plating
Electrical measurements and testing Oscillography
Optical inspection Laminating work up to A3

Laboratory cooperation

There are various collaborations with laboratories at the HTW Dresden and other university and research institutions as well as industry to implement the different tasks in construction and technology. Typical processes are secured through cooperation with the faculty's facilities.

 

Supervising professors and laboratory engineers